Tflex™700 Series Thermal Gap Filler
Product Category:Thremal pads
  • Product Description
  • Features And Benefits
  • Applications
  • Typical Properties
  • TDS Download
  • Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex™ 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.

    • Thermal conductivity 5.0 W/mK
    • Highly compliant
    • Low thermal resistance even at low pressure
    • Available in thicknesses from 0.020” thru 0.200” (0.5mm thru 5.0mm)
    • Naturally tacky for adhesion during assembly and transport

    • Cooling components to chassis, frame  or other mating components 
    • Mass storage devices 
    • Heat pipe thermal solutions for notebook computers
    • Automotive engine control 
    • Telecommunication hardware
    • LED solid state lighting
    • Power electronics
    • Flat panel displays
    • Audio and video components 
    • Computer servers and other IT infrastructure 
    • GPS navigation and other portable devices

  • Typical Properties
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