Tflex™ 600 Series Thermal Gap Filler
Product Category:Thremal pads
Product Introduction:EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER 
  • Product Description
  • Features And Benefits
  • Applications
  • Specification
  • TDS Download
  • Tflex™ 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex™ 600 is electrically  insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.

    •  Very high compliancy for low stress applications
    • 3 W/mK thermal conductivity
    • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm)
    • Naturally tacky, needs no further  adhesive coating

    • Cooling components to the chassis or frame
    • High speed mass storage drives
    • RDRAM memory modules
    • Heat pipe thermal solutions
    • Automotive engine control units
    • Telecommunications hardware

  • Specification
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