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Home > Proucts > IceKap™ P30000
Ice Kap P30000
IceKap™ P30000
Product Category：Silicone-free Thermal pads
Product Introduction：FOR HIGH PERFORMANCE TIM APPLICATIONS
  • Product Description
  • Features And Benefits
  • Applications
  • Typical Properties
  • TDS Download

  • IceKap™ P30000 is a silicone-free, high-performance thermal interface material designed for use in TIM 1.5 and TIM 2 applications.  In certain instances, IceKap ™ P30000 can be used in TIM 1 applications IceKap™ P30000 utilizes a unique polymer chosen to maximize system performance.  The specially designed polymer package: 


    • Minimizes contact thermal resistance at the interface while offering high thermal conductivity  
    • Minimizes migration (pump out) at CPU operating temperatures  
    • Provides “joint healing” capabilities (improved device reliability)  
    • Contains no silicone   
    • Allows easy rework, requiring minimal force to separate components   
    • Survives multiple solder reflow operations 
    IceKap™ P30000 can be pre-applied to components and stored for future shipment to device assmeblers.  



    • Very high thermal performance  
    • Minimal pump out  
    • High reliability   
    • Silicone-free  
    • Joint healing  
    • Easy rework  
    • Solder re-flow compatible 
    • Semiconductor Packaging  
    • Graphics Card  
    • Notebooks  
    • Desktops  
    • Servers  
    • IGBTs  
    • Automotive  
    • Memory Modules  
    • Game Consoles  
    • Set Top Boxes
  • Typical Properties
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