Product Introduction：HIGH PERFORMANCE SCREEN PRINTABLE PHASE CHANGE MATERIAL
FEATURES AND BENEFITS
APPLICATIONS
SPECIFICATIONS
TDS Download
Minimizes contact thermal resistance by filling the microscopic irregularities of the componenets it touches.
Because Tpcm™ 780SP softens but does not fully change states, it is designed to minimize migration (pump out) under thermal cycling from room temperature to chip device operating temperatures.
Available in a 0.5 kg or 1.0 kg can for easy manual screen printing and large volume automatic applications.
