Product Introduction：EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER
Product Description
Features And Benefits
Applications
Specification
TDS Download
Tflex™ 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex™ 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.
Very high compliancy for low stress applications
3 W/mK thermal conductivity
Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm)
Naturally tacky, needs no further adhesive coating
