Tflex™HD300 Series Thermal Gap Filler
Product Category:Thermal pads
Product Introduction:Laird Tflex™ HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products.
  • Product Description
  • Features And Benefits
  • Specification
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  • Laird TflexTM HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products.  TflexTM HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with TflexTM HD300 while generating minimal board and component stress.  Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind. 

    TflexTM HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.   TflexTM HD300 is provided in thickness from 0.5mm (.020”) up to 5mm (.200”) in 0.5mm (.020”) increments as standard.  In addition, Laird can provide TflexTM HD300 in multiple converted formats through approved converters and distribution networks.   
    • 2.7 W/m K thermal conductivity 
    • Low pressure versus deflection characteristics 
    • Excellent surface wetting for low contact resistance 
    • Minimizes board and component stress. 
    • Large tolerance applications 
    • RoHS and REACH compliant
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