Product Introduction：Laird Tflex™ HD80000 is the latest product in the High Deflection gap filler series.
Product Description
Features And Benefits
Specification
TDS Download
Laird Tflex™ HD80000 is the latest product in the High Deflection gap filler series. Tflex™ HD80000 combines 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
6 W/mK thermal conductivity
Low pressure versus deflection
Excellent surface wetting for low contact resistance
No fiberglass reinforcement
Minimizes board and component stress
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
