Tputty™506 Series
Product Category:Thermal GEL
Product Introduction:SOFT, SILICONE PUTTY 
  • Product Description
  • Features And Benefits
  • Application
  • Specification
  • TDS Download
  • Tputty™ 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap  filler is ideal for applications where large gap tolerances are present and in which traditional gap filler  pads may apply added pressure on components. This material can be dispensed to fill large and uneven gaps in assemblies. Tputty™ 506 has a composition which yields superior thermal performance and super compliancy.  This material transfers little to no pressure between interfaces. Because Tputty™ 506 is more viscous  than grease, bleed and pump-out usually associated with grease is eliminated. Specialized rheology  allows for easy flow under pressure. Tputty™ 506 is non-abrasive which leads to less wear on dispensing  equipment and therefore reduced equipment maintenance/repair costs. 
    • Soft and compliant transferring little to no  pressure between interfaces
    • Non-abrasive
    • 3.5 W/mK thermal conductivity
    • Available in 75 cc, 180 cc, 360 cc and 600 cc  dispensing cartridges
    • Available in 20 kg pails
    • Easily dispensable from an EFD  dispensing system

    • Microprocessors
    • Graphic chips
    • Automotive
    • LED lighting

  • Specification
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