Product Introduction：HIGHEST THERMAL CONDUCTIVITY COMPLIANT GAP FILLER
Product Description
Features And Benefits
Applications
Typical Properties
TDS Download
Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex™ 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.
Thermal conductivity 5.0 W/mK
Highly compliant
Low thermal resistance even at low pressure
Available in thicknesses from 0.020” thru 0.200” (0.5mm thru 5.0mm)
Naturally tacky for adhesion during assembly and transport
Cooling components to chassis, frame or other mating components
Mass storage devices
Heat pipe thermal solutions for notebook computers
