Tflex™ HD700 Series Thermal Gap Filler
Product Category:Thermal pads
Product Introduction:Laird Tflex™ HD700 is our latest product in our High Deflection series.
  • Product Description
  • Features And Benefits
  • Specification
  • TDS Download
  • Laird Tflex™ HD700 is our latest product in our High Deflection series. Tflex™ HD700 combines 5W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance.

    As a result, less mechanical and thermal stresses will be experienced within your device. Tflex™ HD700 is available in thickness from 0.5mm (0.020”) to 5mm (0.200”). Laird can provide material to meet your production needs in any region through our local production facilities.
    • 5.0 W/mK thermal conductivity
    • Low pressure versus deflection
    • Excellent surface wetting for low contact resistance
    • Minimizes board and component stress
    • Large tolerance applications
    • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

  • Specification
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