GAP FILLER AVAILABLE Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™ SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive. Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.
Silicone-free gap filler
Thermal Conductivity of 7.8 W/mK
Exceptionally low thermal resistance
Available in thicknesses from 0.020-inch (0.50mm) through 0.040-inch (1.00mm) in 0.010-inch increments
