Laird’s Ecofoam™offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side. Ecofoam™ can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. Ecofoam™ is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.
