Product Introduction：Tlam SS 1KA™ is a thermally conductive printed circuit board (PCB) substrate.
Product Description
Features And Benefits
Applications
TDS Download
Tlam SS 1KA™ is a thermally conductive printed circuit board (PCB) substrate. The substrate consists of a copper circuit layer bonded to an aluminum or copper base plate with Laird Technologies’ 3 watt/m-K 1KA dielectric. Tlam SS 1KA™ materials are processed through standard FR4 print and etch operations.
Tlam SS 1KA has 8-10 times better thermal conductivity compared to FR4, and this is the key to keeping components cool. The Tlam SS 1KA boards run through standard pick and place SMT and manual wire bond processes.
Tlam SS 1KA is designed for applications that require the best thermal performance and resistance to thermal cycling. Customers have found that Tlam SS 1KA reduces the stress on solder bonds with ceramic devices.
Standard constructions are made with 1 and 2 ounce copper and 0.040 (1 mm) and 0.062 (1.6 mm) inch thick aluminum. Custom constructions of heavier weight circuit copper and thicker aluminum and copper base plates are also available.
UL 746B Electrical/Mechanical RTI as high as 130°C
